PCB Impedance Calculator

Calculate characteristic impedance for microstrip and stripline PCB transmission lines

Calculate PCB Impedance

Width of the copper trace

Thickness of the copper trace (typically 0.5-2.8 mils)

Distance from trace to ground plane

Relative permittivity of substrate material (FR4 ≈ 4.3-4.5)

Impedance Results

0.0Ω
Characteristic Impedance
0.00
Effective Dielectric Constant
0.0 ps/in
Propagation Delay
0.00 in/ns
Signal Velocity

Configuration: Microstrip -0.0 × 0.0 mils trace, 0.0 mils substrate

W/H Ratio: NaN - Substrate: εᵣ = 4.5

Impedance Analysis

Example Calculation

50Ω Microstrip Design

Target: 50Ω characteristic impedance

Substrate: FR4 (εᵣ = 4.3), H = 8 mils

Trace: 1 oz copper (T = 1.4 mils)

Required width: ~14.7 mils

100Ω Differential Pair

Target: 100Ω differential impedance

Single-ended: ~50Ω each trace

Coupling: Tight coupling reduces differential impedance

Common: USB, Ethernet, LVDS applications

Common Substrate Materials

FR44.3 - 4.5
Rogers RO4003C3.38
Rogers RO4350B3.48
Teflon/PTFE2.1
Ceramic9.8

Standard Impedances

50

50Ω

RF, microwave, high-speed digital

75

75Ω

Video, cable TV, antenna systems

100

100Ω

Differential pairs (USB, Ethernet)

Design Tips

Wider traces = lower impedance

Thicker substrate = higher impedance

Lower εᵣ = higher impedance

Use controlled impedance for high-speed signals

Consider manufacturing tolerances (±10%)

Understanding PCB Impedance

What is Characteristic Impedance?

Characteristic impedance is the impedance that a transmission line presents to a signal as it propagates along the line. It depends on the physical geometry and materials of the PCB trace and its surrounding dielectric.

Why Control Impedance?

  • Minimize signal reflections
  • Maintain signal integrity
  • Reduce electromagnetic interference
  • Enable high-speed digital communication

Microstrip vs Stripline

Microstrip

Surface trace with ground plane below. More affected by environmental factors but easier to route and modify.

Stripline

Embedded trace between ground planes. Better shielding and more stable impedance but requires more PCB layers.

Note: Calculations are based on IPC-2141A standards and are approximations. Always verify with electromagnetic field solvers for critical applications.